Cookson Semiconductor Packaging Materials
Cookson Semiconductor Packaging Materials, a Cookson Electronics Company, is headquartered in Alpharetta, GA.
Listing updated
About Cookson Semiconductor Packaging Materials
Cookson Semiconductor Packaging Materials, a Cookson Electronics Company, is headquartered in Alpharetta, GA. It is the business unit within Alpha-Fry Technologies focused on the semiconductor packaging industry, and describes itself as the world leader in the development, manufacturing and sales of innovative materials used in the manufacturing of BGA, CSP and Flip Chip semiconductor packages.
CSPM's products include PLASKON brand epoxy molding compounds; area array solder products, including spheres, pastes and BGA flux; and STAYSTIK thermoplastic adhesives, STAYDRY getter materials, STAYCHIP underfills and encapsulants, and POLYSOLDER conductive adhesives.
- Category
- Electronic Components
- Location
- Singapore
- Website
- semiconductoronline.com
Summary written with AI from public business data. Disclaimer
Products & services
- PLASKON brand epoxy molding compounds
- Area array solder products, including spheres, pastes and BGA flux
- STAYSTIK thermoplastic adhesives
- STAYDRY getter materials
- STAYCHIP underfills and encapsulants
- POLYSOLDER conductive adhesives
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Location
Quick facts
- Business name
- Cookson Semiconductor Packaging Materials
- What it supplies
- Cookson Semiconductor Packaging Materials is listed under Electronic Components.
- Category
- Electronic Components
- Location
- Singapore
- Listed products and services
- PLASKON brand epoxy molding compounds; Area array solder products, including spheres, pastes and BGA flux; STAYSTIK thermoplastic adhesives; STAYDRY getter materials; STAYCHIP underfills and encapsulants; POLYSOLDER conductive adhesives. (Summarised with AI from public business data.)
- How to contact
- Phone, website and an enquiry form on this page.
- Listing last updated