Tong Hsing Electronics Phils Inc
Tong Hsing Electronics Phils. Inc. is located at 103 Prosperity Ave., Carmelray International Business Park 1, Brgy. Canlubang, Calamba, Calabarzon.
Listing updated
About Tong Hsing Electronics Phils Inc
Tong Hsing Electronics Phils. Inc. is located at 103 Prosperity Ave., Carmelray International Business Park 1, Brgy. Canlubang, Calamba, Calabarzon. The company is a contract manufacturer of microelectronics packaging, IC hybrid assembly, and ceramic thick film substrates.
Its website describes it as an IC Hybrid assembly house specializing in Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages, PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules (especially RF Modules, Image Products), and ceramic assembly manufacturing using Thick Film and DPC processes. Clean room environments range from class 10, 100, 1000, 10K and 100K.
- Category
- ELECTRONIC PARTS ASSEMBLERS
- Location
- Calamba, Calabarzon
- Website
- tonghsing.ph
Listing details come from public business profiles (data from Meta via Overture Maps, CDLA Permissive 2.0) and have not yet been confirmed by the business. Is this your business? Ask us to update or remove it.
Summary written with AI from public business data. Disclaimer
Products & services
- Contract manufacturing for microelectronics packaging
- Ceramic thick film substrate fabrication
- IC Hybrid assembly (CSP – LGA/BGA packages)
- PCB assembly with SMT and COB processes
- Multi Chip Modules (RF Modules, Image Products)
- Ceramic assembly manufacturing (Thick Film and DPC)
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Location
Quick facts
- Business name
- Tong Hsing Electronics Phils Inc
- What it supplies
- Tong Hsing Electronics Phils Inc is listed under ELECTRONIC PARTS ASSEMBLERS.
- Category
- ELECTRONIC PARTS ASSEMBLERS
- Location
- Calamba, Calabarzon, Philippines
- Listed products and services
- Contract manufacturing for microelectronics packaging; Ceramic thick film substrate fabrication; IC Hybrid assembly (CSP – LGA/BGA packages); PCB assembly with SMT and COB processes; Multi Chip Modules (RF Modules, Image Products); Ceramic assembly manufacturing (Thick Film and DPC). (Summarised with AI from public business data.)
- How to contact
- Phone, email, website and an enquiry form on this page.
- Listing last updated