STATS ChipPAC Pte Ltd (SCS)
STATS ChipPAC Pte Ltd (SCS) provides semiconductor packaging and technology solutions, describing itself as an integrated circuit manufacturing and technology services provider.
Listing updated
About STATS ChipPAC Pte Ltd (SCS)
STATS ChipPAC Pte Ltd (SCS) provides semiconductor packaging and technology solutions, describing itself as an integrated circuit manufacturing and technology services provider. Its turnkey services include semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment to vendors worldwide.
The company states 30+ years of semiconductor backend manufacturing expertise and 20+ operational locations worldwide. Its packaging technologies include wirebond, flip chip, wafer level packaging, system-in-package, MEMS and sensors packaging, and 2.5/3D packaging solutions, serving applications in automotive, computing, memory, AI edge, and power and energy.
- Category
- ELECTRONIC PARTS ASSEMBLERS
- Location
- Singapore
- Website
- statschippac.com
Summary written with AI from public business data. Disclaimer
Products & services
- Semiconductor packaging
- Wafer bumping
- Package assembly
- Final testing
- Wafer probing
- Turnkey solutions (design to test)
- Wirebond, flip chip, wafer level, SiP, MEMS & sensors, and 2.5/3D packaging
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Quick facts
- Business name
- STATS ChipPAC Pte Ltd (SCS)
- What it supplies
- STATS ChipPAC Pte Ltd (SCS) is listed under ELECTRONIC PARTS ASSEMBLERS.
- Category
- ELECTRONIC PARTS ASSEMBLERS
- Location
- Singapore
- Listed products and services
- Semiconductor packaging; Wafer bumping; Package assembly; Final testing; Wafer probing; Turnkey solutions (design to test); Wirebond, flip chip, wafer level, SiP, MEMS & sensors, and 2.5/3D packaging. (Summarised with AI from public business data.)
- How to contact
- Phone, website and an enquiry form on this page.
- Listing last updated