Besi Apac Sdn. Bhd.

Name: Besi Apac Sdn. Bhd.
Address: 3, Jalan Sungai Besar 26/7, Hicom Industrial Estate, 40400 Shah Alam, Selangor, Shah Alam, Selangor, Malaysia
Telephone: +603-55147777

Shah Alam, Selangor, Malaysia

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Besi Apac Sdn. Bhd. (Malaysia) is a leading manufacturer specializing in advanced assembly processes and equipment for semiconductor packaging applications. The company serves a diverse range of industries, including electronics, automotive, industrial, LED, and solar energy, with a focus on leadframe, substrate, and wafer-level packaging solutions. Its global reach and cutting-edge technology cater to B2B clients in high-tech manufacturing sectors.

Main Products and Services

Datacon 8800 FC QUANTUM, Esec 2100 hS, Fico Compact Line - X, Meco CDL 1500, AMS-X

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Related Services & Products

semiconductor manufacturing packaging-equipment electronics automotive industrial malaysia b2b

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Contact Information

Phone

+603-55147777

Website

www.besi.com

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Address

3, Jalan Sungai Besar 26/7, Hicom Industrial Estate, 40400 Shah Alam, Selangor

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