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Bondztek Equipment Sdn. Bhd. (Melaka, Malaysia) is a specialized equipment supplier for the semiconductor backend industry, focusing on refurbishment, retrofit, and spare parts for die attach and wire bond equipment. With over 30 years of expertise, they serve semiconductor manufacturers globally, offering turn-key solutions to extend equipment lifespan. Their facility includes a refurbishment workshop and customer buyoff lab.
Main Products and Services
ASM AD896-IL08 Die Attach, Shinkawa UTC5000 Super NeoCu Wire Bonder, ESEC 2008HS3 Plus Die Attach, Delvotec 6600 Wire Bonder, Bondztek Inline Oven
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